01 / PLATFORM OVERVIEW

From Idea to Physical Reality.

JAGRIX is the AI-native connected engineering platform that unites product design, electronics, 3D CAD, firmware, and multi-physics simulation.

01.1

Unified Engineering Cloud

  • Eliminates handoff friction between EE, ME, firmware, and fab teams.
  • Single real-time source of truth for schematics, 3D CAD, code, and BOM.
  • Instant cross-disciplinary synchronization with zero file conversions.
01.2

10 Intelligent Workspaces

  • Specialized domain AI agents guide every stage from prompt to production.
  • Autonomous schematic synthesis, PCB routing, and enclosure generation.
  • Live component inventory tracking, pricing alerts, and lifecycle monitoring.
01.3

Zero-Spin Digital Twin

  • Continuous multi-physics solver simulates signals, thermals, and stress.
  • Virtual firmware execution on simulated silicon before physical board fab.
  • Eliminates costly $50k+ hardware prototype re-spins and tooling delays.
STARTING POINT 01 Idea
AI WORKSPACES 10 Stages
HARDWARE HORIZONS ∞ Possibilities
SLIDE 01 OF 12 • PLATFORM OVERVIEW
02 / IDEA CONCEPTION & SPECIFICATION

Turn vision into verified specifications.

Convert natural language intent, rough sketches, and customer requirements into rigorous, machine-verifiable product engineering specifications.

02.1

Prompt-to-Specification Engine

  • AI extracts operating constraints, battery runtime targets, and BOM cost limits.
  • Automatically detects target environmental conditions and operating temperatures.
  • Flags regulatory benchmarks (FCC, CE, RoHS, UL) at initial concept definition.
02.2

Requirements Traceability

  • Hierarchically breaks down features into electrical, mechanical, and code specs.
  • Maintains live bidirectional links between requirements and design choices.
  • Instant impact analysis when any functional or performance parameter changes.
02.3

System Functional Architecture

  • Produces system block diagrams delineating compute hubs, sensors, and power.
  • Allocates primary communication buses (I2C, SPI, CAN, USB, BLE, Wi-Fi).
  • Locks verified architectural milestones ready for immediate schematic assignment.
Phase 1: Idea Ingestion Phase 2: Constraint Modeling Phase 3: Verified Spec Lock
SLIDE 02 OF 12 • IDEA & REQUIREMENTS
03 / AI SYSTEM ARCHITECTURE

AI-driven multidisciplinary architecture.

Concurrently synthesize electrical power topologies, enclosure volume restrictions, thermal dissipations, and MCU architectures without manual spreadsheets.

03.1

Smart Silicon & Part Selection

  • Evaluates thousands of MCUs, PMICs, and transceivers against requirements.
  • Checks real-time global distributor stock, pricing curves, and lead times.
  • Recommends pin-compatible alternates to safeguard against supply chain shocks.
03.2

Cross-Domain Conflict Solver

  • Ensures mechanical enclosure thickness accommodates component heights.
  • Aligns connector orientations with enclosure cutouts and user ergonomics.
  • Guarantees strict antenna keep-out clearances and ground return continuity.
03.3

Interactive Topology Graph

  • Live connected graph for Requirements, Electronics, Mechanics, and Firmware.
  • Edits in one domain instantly propagate and alert all dependent branches.
  • Generates continuous real-time BOM cost projections with live supplier APIs.
Silicon Allocation Mechanical Keep-Outs Firmware Pin Map BOM Prediction
SLIDE 03 OF 12 • AI ARCHITECTURE
04 / ELECTRONICS & EDA AUTOMATION

Automated schematics to precision PCB layout.

Generate production-ready schematics, select verified components, route high-density multilayer PCBs, and execute automated design rule checks (DRC).

04.1

AI Schematic Synthesis

  • Translates functional block diagrams into complete SPICE-ready schematics.
  • Automatically calculates decoupling capacitors, ESD protection, and pull-ups.
  • Applies proven design templates for power management and sensor interfaces.
04.2

Verified Component Sourcing

  • Access millions of verified schematic symbols, footprints, and 3D STEP models.
  • Monitors lifecycle statuses: Active, Not Recommended (NRND), and Obsolete (EOL).
  • Direct live inventory mapping with DigiKey, Mouser, and LCSC.
04.3

High-Speed PCB Routing

  • Automated differential pair routing with strict length matching and tuning.
  • Continuous ground plane returns, thermal relief vias, and EMI suppression.
  • Full compliance with IPC-2221 Class 2/3 fabrication and assembly standards.
Schematic Capture Component Sourcing Multilayer Routing IPC-2221 Compliance
SLIDE 04 OF 12 • ELECTRONICS & PCB
05 / MECHANICAL & 3D INDUSTRIAL DESIGN

Design the enclosure around the electronics.

Engineer precision 3D CAD models, snap-fit enclosures, and thermal heat dissipation structures perfectly synchronized with your PCB geometry.

05.1

Live ECAD-MCAD Sync

  • Moving an enclosure boss or port instantly updates PCB board edge keep-outs.
  • Eliminates loss of fidelity caused by traditional STEP/IGES file transfers.
  • Automates fastener placements, standoff dimensions, and connector cutouts.
05.2

Generative Enclosure Engineering

  • Optimized for injection molding, CNC milling, sheet metal, or 3D printing.
  • Automated draft angles, uniform wall thicknesses, and rib reinforcements.
  • Ergonomic surface styling tailored to functional product requirements.
05.3

Tolerance & Ingress Protection

  • Simulates fastener torque allowances, deflection, and assembly stack-up fits.
  • Gasket channels engineered for IP67 / IP68 dust and water ingress sealing.
  • Simulates drop-test impact shock to reinforce high-stress fracture zones.
Parametric 3D CAD Tooling Feasibility IP67/68 Ingress Seals Drop Impact Analysis
SLIDE 05 OF 12 • MECHANICAL DESIGN
06 / EMBEDDED FIRMWARE & LOGIC

Bring the hardware to life with code.

Generate deterministic device drivers, hardware abstraction layers (HAL), and real-time embedded control code mapped directly to your hardware pinouts.

06.1

Datasheet-to-Driver Synthesis

  • Generates zero-overhead C/C++ and Rust drivers directly from chip register maps.
  • Configures clock trees, GPIO multiplexing, and DMA channels without errors.
  • Pre-built communication drivers for I2C, SPI, UART, CAN, BLE, and Wi-Fi.
06.2

Deterministic RTOS Architecture

  • Pre-configured FreeRTOS and Zephyr tasks with deterministic priority queues.
  • Thread-safe memory management and strict interrupt latency guarantees.
  • Intelligent deep-sleep power states to maximize battery operational lifespan.
06.3

Virtual QEMU Silicon Emulation

  • Run and debug firmware binaries against digital hardware twins before fabrication.
  • Validates state machines, edge cases, and sensor protocols virtually.
  • Includes secure bootloader architecture and over-the-air (OTA) update scaffolding.
HAL Driver Synthesis Deterministic RTOS QEMU Virtual Silicon Secure OTA Bootloader
SLIDE 06 OF 12 • FIRMWARE & LOGIC
07 / MULTI-PHYSICS SIMULATION

Validate physics virtually before fabrication.

Predict electrical signal integrity, semiconductor thermal dissipation, and structural stress using integrated multi-physics solvers.

07.1

Signal & Power Integrity (SI/PI)

  • Eye diagram analysis, cross-talk reduction, and trace reflection calculations.
  • DC IR drop analysis across high-current copper power planes under peak surge.
  • Detects high-frequency impedance discontinuities across microstrip layers.
07.2

Thermal & Airflow CFD

  • 3D computational fluid dynamics models natural and forced enclosure airflow.
  • Identifies thermal hotspots on power semiconductors, PMICs, and processors.
  • Optimizes heat sink fin density, thermal vias, and ventilation port geometries.
07.3

Structural Stress & Drop (FEA)

  • Finite element analysis evaluates drop impact shock and harmonic resonance.
  • Validates solder joint fatigue resistance across thermal expansion cycles.
  • Guarantees compliance with MIL-STD-810 and IEC 60068 physical standards.
Signal Integrity (SI/PI) Thermal CFD Heatmaps FEA Drop Impact RF Radiation Pattern
SLIDE 07 OF 12 • MULTI-PHYSICS SIMULATION
08 / SYSTEM VERIFICATION & COMPLIANCE

Total system verification and compliance.

Cross-layer verification combines automated rule engines and digital testbenches to eliminate unexpected production defects and costly certification delays.

08.1

Cross-Domain Rule Engine

  • Verifies that electrical currents match mechanical heat dissipation capabilities.
  • Confirms firmware timings respect physical sensor hardware latency limits.
  • Guarantees 100% netlist, component footprint, and 3D CAD consistency.
08.2

Virtual EMI / EMC Pre-Scan

  • Identifies radiated and conducted emissions before expensive lab testing.
  • Detects slot antennas caused by split ground planes and high di/dt current loops.
  • Minimizes risk of failing official FCC Part 15 and CE certification tests.
08.3

Automated Virtual Testbench

  • Hardware-in-the-loop virtual testing stimulates simulated sensors and monitors outputs.
  • Tests brownout recovery, voltage spikes, and emergency fail-safe shutdowns.
  • Automated regression testing triggers on every schematic or layout modification.
Cross-Domain Audit Virtual EMI Pre-Scan Fail-Safe Logic Zero Design Regressions
SLIDE 08 OF 12 • VERIFICATION & COMPLIANCE
09 / MANUFACTURING & PRODUCTION PACKAGES

Production-ready deliverables in one click.

Generate fabrication files, pick-and-place centroid data, and custom automated factory test fixtures ready for immediate contract manufacturing.

09.1

Design For Manufacturability (DFM)

  • Audits board layout against manufacturer-specific fab house constraints.
  • Verifies trace-to-pad clearances, annular rings, and solder mask dams.
  • Eliminates component tombstoning, bridging, and alignment errors during reflow.
09.2

One-Click Production Package

  • One-click export of Gerber RS-274X, IPC-2581, ODB++, and standardized drill tables.
  • Automated centroid XY coordinates for high-speed SMT pick-and-place lines.
  • Structured bill of materials (BOM) with manufacturer part numbers (MPNs).
09.3

Automated Test Fixture CAD

  • Generates 3D CAD files for custom pogo-pin programming and test jigs.
  • Exports automated test scripts (Python, C) for production line QA verification.
  • Ensures rapid hardware bring-up and consistent unit yields from batch one.
DFM / DFA Validation IPC-2581 Production Export SMT Pick & Place Pogo-Pin Test Jigs
SLIDE 09 OF 12 • MANUFACTURING & DFM
10 / DEPLOYMENT & PRODUCTION BRING-UP

From concept to deployed hardware.

Consolidate months of fragmented trial-and-error into a rapid, cohesive path from concept to physical hardware deployed in the field.

10.1

10x Accelerated Velocity

  • Compress typical 9–12 month development cycles into 3–4 weeks.
  • Concurrent engineering agents eliminate sequential handoff bottlenecks.
  • Accelerates time-to-market and initial product launch window.
10.2

First-Spin Working Hardware

  • Eliminate $50k+ prototype re-spins and tooling rework costs.
  • Deep virtual simulation guarantees functional correctness before ordering parts.
  • Receive working prototype boards that boot up on the very first try.
10.3

Fleet Telemetry & OTA

  • Seamless bridge from factory flashing to live operational field telemetry.
  • Real-time battery health, sensor calibration, and anomaly detection.
  • Secure end-to-end encrypted firmware OTA updates deployed worldwide.
READY FOR PRODUCTION BRING-UP • Full telemetry, field diagnostics, and encrypted OTA
SLIDE 10 OF 12 • FINISHED PRODUCT
11 / THE JAGRIX ADVANTAGE

One platform. Infinite engineering possibilities.

Replace disjointed EDA software, mechanical CAD suites, and isolated firmware IDEs with an interconnected, AI-orchestrated design environment.

A

AI-Native Co-Pilot

  • Autonomous agents handle repetitive routing, part discovery, and simulation.
  • Engineers maintain creative control while automating tedious manual steps.
B

Unified Database

  • Electronics, mechanical enclosures, and firmware operate on a shared model.
  • Zero translation errors, zero file version mismatches, zero lost requirements.
C

Continuous Physics

  • Test firmware on virtual circuits and thermal models before manufacturing.
  • Debug hardware faults virtually without expensive lab oscilloscopes.
D

Real-World Impact

  • Built for mission-critical hardware: IoT, robotics, medical, and aerospace.
  • Guaranteed manufacturing file compliance with global EMS fabrication partners.
Think Build Simulate Transform
SLIDE 11 OF 12 • WHY JAGRIX
12 / GET STARTED TODAY

Your idea deserves to exist.

Join engineers, startups, and enterprise teams designing and building next-generation physical products with JAGRIX.

ACTION 01

Free Engineering Workspace

  • Instant access to AI-assisted schematic creation.
  • Parametric 3D enclosure preview in your browser.
  • Full access to component library with live pricing.
ACTION 02

Enterprise Architecture Demo

  • Custom component library and supplier integrations.
  • Dedicated private AI models and compliance pipelines.
  • Direct integration with your contract manufacturing partners.
JAGRIX
THINK • BUILD • TRANSFORM

Contact Us: officialjarix@gmail.com

SLIDE 12 OF 12 • GET STARTED